SANTA CLARA, Calif.--(BUSINESS WIRE)--Jul. 14, 2009--
While the current economic environment is imposing severe constraints on
the semiconductor equipment industry, the primary driver for increasing
profitability for leading-edge chipmakers is still Moore’s Law. However,
moving to the next technology node will require even higher levels of
R&D investment to overcome key technical barriers. The semiconductor
equipment industry must find ways to make today’s reduced R&D budgets
meet these challenges.
“The current size of the wafer fabrication equipment industry does not
support the significant levels of R&D spending needed to follow Moore’s
Law and deliver leading-edge systems and processes to customers. This is
becoming an increasingly evident as logic, DRAM and flash technologies
continue to diverge,” said Tom St. Dennis, senior vice president and
general manager of Applied’s Silicon Systems Group. “To support our
customers in advancing their technology roadmaps and provide critical
customer services, we see the need for new business models and alliances
to optimize the utilization of our industry’s resources.”
At SEMICON West in San Francisco this week, Applied Materials, Inc. will
focus on the strategies and technologies that will be needed for the
semiconductor industry to successfully navigate these challenging times.
In an important ITRS keynote panel on July 15, moderated by George
Scalise, president of the SIA, St. Dennis will join a panel of experts
representing a cross-section of the industry who will explore the impact
of business model shifts on “the Future of Innovation.”
Tom St. Dennis will also be featured at SEMI’s press luncheon panel on
July 14 where he will provide insights into how the macroeconomic
environment, market drivers and cleantech are influencing the pace and
direction of R&D in semiconductor technology.
At SEMI’s popular TechXPOT seminars, Applied will present key strategies
from three-dimensional (3-D) TSV* chip packaging to cutting-edge unit
process technologies. 3-D IC integration is a new way for chip designers
to deliver higher density, lower power consumption devices without
necessarily scaling the technology node. Find out how Applied and other
equipment suppliers are working together to enable the cost-effective
adoption of this exciting technology.
Applied’s technologists will also share the latest advances in
fabrication technology, including novel epitaxial processes for boosting
transistor performance and innovations to extend PVD technology to the
22nm node and beyond without employing risky new integration schemes.
For a complete schedule of Applied’s participation in the SEMICON West
technical program, visit www.appliedmaterials.com/about/events.html.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in
Nanomanufacturing Technology™ solutions with a broad portfolio of
innovative equipment, service and software products for the fabrication
of semiconductor chips, flat panel displays, solar photovoltaic cells,
flexible electronics and energy efficient glass. At Applied Materials,
we apply Nanomanufacturing Technology to improve the way people live.
Learn more at www.appliedmaterials.com.
*TSV=through silicon via
Source: Applied Materials, Inc.
Applied Materials, Inc.
Connie Duncan, 408.563.6209
(editorial/media)
Michael Sullivan, 408.986.7977 (financial
community)
