News Release

Multimedia Available: Chipmakers Break Low k Barrier, Take Leap Forward to Drive Next-Generation Electronics Using Applied Black Diamond

Feb 4, 2004 at 7:28 PM EST

--(BUSINESS WIRE)--

Key semiconductor designers, manufacturers and Applied Materials Inc. today mark the beginning of the Low k Era in chipmaking. Semiconductor companies Agere Systems, Altera Corp., AMD, ATI Technologies, LSI Logic, NEC and Toshiba, and semiconductor foundry TSMC, are utilizing Applied Materials' Black Diamond(R) low k film to manufacture some of the world's most advanced chips.

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    SOURCE: Newstream and Applied Materials Inc.