News Release

Multimedia Available: Applied Materials Transcends the Boundaries of Traditional Wafer Inspection with New ComPlus-EV

Jul 10, 2003 at 8:36 AM EDT

--(BUSINESS WIRE)--

Applied Materials Inc. breaks through the barriers of traditional wafer inspection technology with its innovative ComPlus(tm)-EV, the industry's only system that performs high-speed wafer inspection for all darkfield and key brightfield applications for 90nm production. Using proprietary Enlarged GrayField(tm) technology, this single-system solution captures up to 50 percent more defects than the previous system at speeds of up to 60 wafers per hour, enabling faster ramps and higher production yields.

    You can reach the story directly by going to
http://www.newstream.com/cgi-bin/display_story.cgi?10004 

This multimedia news story is for free and unrestricted use on your news information site (and for print or broadcast too). Visit http://www.newstream.com to download video, audio, text, graphics, and photos.

If you have any questions about the story, or about Newstream.com, please write to us at info@newstream.com.


    CONTACT: Newstream.com, New York
             info@newstream.com

    SOURCE: Newstream and Applied Materials Inc.