SANTA CLARA, Calif.--(BUSINESS WIRE)--May. 28, 2009--
While seeking “faster, cheaper, smaller” devices through continued
scaling, chipmakers are also looking to new three-dimensional methods to
achieve greater performance and functionality. Whether scaling down in
two dimensions or scaling vertically in the third, key challenges
remain, from finding the right low k solution and controlling resistance
scaling in advanced interconnects to deciding which of the many TSV
process flows will emerge as the industry’s standard.
On June 1st, at a forum hosted by Applied Materials, a panel
of industry thought leaders will share their strategies to advance the
state of the art in interconnect metallization technology. The program
will be led by Dr. Hans Stork, chief technology officer of Applied’s
Silicon Systems Group, and feature speakers from IMEC, Samsung, Semitool
and Toshiba. This important event will take place in conjunction with
the prestigious IEEE International Interconnect Technology Conference
(IITC), which is being held this year in Sapporo, Japan.
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Title:
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“Multiple Dimensions of Metallization – from Interconnect to 3D
Integration”
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Where:
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Royton Sapporo Hotel
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Hokkaido, Japan
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When:
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Monday, June 1st, 2009
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Schedule:
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5:30pm Registration and Reception
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6:00pm Seminar program
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7:00pm Panel Discussion
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To register:
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www.appliedmaterials.com/2009_IITC/
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Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in
Nanomanufacturing Technology™ solutions with a broad portfolio of
innovative equipment, service and software products for the fabrication
of semiconductor chips, flat panel displays, solar photovoltaic cells,
flexible electronics and energy efficient glass. At Applied Materials,
we apply Nanomanufacturing Technology to improve the way people live.
Learn more at www.appliedmaterials.com.
Source: Applied Materials, Inc.
Applied Materials, Inc.
Connie Duncan, 408-563-6209
(editorial/media)
Michael Sullivan, 408-986-7977 (financial
community)
