Applied Materials Solves Critical Copper Challenges With New Mirra CMP Process
SANTA CLARA, Calif.--(BUSINESS WIRE)--April 8, 1999--
New Copper CMP Process for the Mirra System Enables
Copper (Cu) Dual Damascene Chip Production
Applied Materials, Inc., the leading supplier of CMP (chemical mechanical polishing) systems to the semiconductor industry, today introduced a production-capable copper CMP process for its Mirra(R) CMP system. The new Mirra Electra(TM) CMP system advances the industry's ability to implement dual damascene copper interconnect technology for high-speed semiconductor chips by enabling high-precision removal and planarization of copper and barrier films.
"As the industry transitions to copper-based chips, one of the
most challenging roadblocks has been copper CMP," said Chris Smith,
general manager of Applied Materials' CMP Division. "It requires more
advanced process capabilities than previous CMP applications because
the materials are more difficult to polish, and the result has a
greater impact on device performance. Our new copper CMP process takes
full advantage of the unique multi-platen architecture of our
production-proven Mirra system to provide the process control and
productivity that customers need to break through their copper CMP
technology barrier."
Applied Materials currently has nine Mirra Electra CMP systems
placed at customer sites, with commitments for multiple additional
systems worldwide. According to Dataquest, a market research firm, the
market for all CMP semiconductor applications is forecast to reach
$600 million in 1999 and is expected to grow to $1.5 billion by 2003.
Copper CMP is just emerging as a volume application; sales for copper
CMP equipment are expected to grow at a compound annual growth rate of
76 percent through the year 2003.
Introduced in 1995, Applied Materials' Mirra CMP tool is the
leading system used for planarizing devices at 0.25 micron and below
geometries, with approximately 250 systems installed throughout the
world. As part of Applied Materials' "Electra" copper product line,
the Mirra Cu CMP system joins with the company's Millennia(TM) ECP
system, also announced today, and Endura(R) Barrier and Seed system to
provide customers with a Total Solutions(R) approach to their copper
interconnect manufacturing requirements.
"By working closely with our customers, consumables suppliers and
other product groups at Applied Materials, we were able to focus
simultaneously on all the process and integration issues that affect
the CMP process," said Rob Davenport, global product director of
Applied Materials' CMP Division. "This strategy enabled us to develop
a process that has been fully optimized for customers' high-volume
production requirements."
Copper CMP is the final and key step in the dual damascene copper
process flow. After barrier, seed and copper fill layers are deposited
in the interconnect structures, CMP is used to remove excess film from
the wafer, leaving a smooth, flattened surface for building subsequent
circuit layers. The challenge for copper CMP systems has been to
achieve the process control necessary to provide uniform wafer
planarity with minimal loss of copper in the interconnects for optimum
device performance.
"Prior to the Mirra's Electra Cu CMP process, performing copper
CMP with acceptable uniformity and repeatability was difficult due to
the need to polish different materials (copper and tantalum or
tantalum nitride) that have very different polish rates. Any excess
copper loss in the polishing process can negate the benefits of using
this low-resistance material to achieve faster chip speeds," said
Davenport. "The Mirra achieves a new standard for minimizing such
process problems as copper dishing and oxide erosion with a range of
features that include a multi-platen architecture, Titan Head(TM)
polisher and endpoint detection technology."
The Mirra's multi-platen design takes wafers through a sequence
of different process steps that polish the wafer with different
slurries at different rates as it moves between polishing platens. The
system's revolutionary Titan Head(TM) design, introduced in 1997 for
oxide polishing, enables a low pressure process that helps minimize
dishing and erosion and provides excellent uniformity across the
wafer. Since the soft copper fill layer and the hard barrier layer
have different removal rates, the ability to polish at very low
pressure and conform to wafer variations is a key advantage that
contributes to higher device yield.
Also contributing to the system's superior results is Applied
Materials' proprietary In Situ Rate Monitor (ISRM(TM)) endpoint
technology which allows realtime monitoring of the CMP process.
Traditional "timed" processes typically have problems with excessive
overpolishing, resulting in unacceptable dishing of the copper
interconnect lines. The ISRM accurately identifies the transition
between the copper and barrier films to determine the precise point at
which to end the process and ensure minimal loss of device features.
Controlling defects is another critical requirement for
production-worthy copper CMP. The Mirra Cu CMP process introduces a
unique ElectraClean(TM) solution that reduces post-copper CMP defects
and resists corrosion. Confirmed in defect performance data collected
from equipment and process marathons, the new ElectraClean solution
and optimized CMP process minimizes microscratches and demonstrates
low, stable defect counts.
Applied Materials is the only company that offers products for
all of the key process steps required for dual damascene copper
interconnect fabrication. Leveraging this range of technologies, the
company also offers the Copper Interconnect Equipment Set Solution(TM)
(ESS(TM)). Launched in late 1998, the Copper Interconnect ESS provides
customers with the equipment, integrated process technology and
guaranteed electrical results for manufacturing dual damascene
structures. The Mirra Electra CMP system is available as a standalone
system or as part of the Copper Interconnect ESS.
Applied Materials, Inc. is a Fortune 500 global growth company
and the world's largest supplier of wafer fabrication systems and
services to the global semiconductor industry. Applied Materials is
traded on the Nasdaq National Market System under the symbol "AMAT."
Applied Materials' web site is www.appliedmaterials.com.
--30--slt/sf* CONTACT: Applied Materials, Inc. Connie Duncan, 408/563-6209 (editorial/media) Carolyn Schwartz, 408/748-5227 (financial community) KEYWORD: CALIFORNIA INDUSTRY KEYWORD: COMPUTERS/ELECTRONICS COMED PRODUCT