Applied Materials Introduces the Metal Etch DPS Plus Centura for Sub-0.18 Micron Metal Etch
SANTA CLARA, Calif.--(BUSINESS WIRE)--April 13, 1999--
Significant Advancements to Industry's Leading Metal Etch
System Boost Throughput, Uptime and Reduce Operating Cost
Applied Materials, Inc., the world's largest supplier of etch systems to the semiconductor industry, introduces the Metal Etch DPS Plus Centura, an advanced metal etch system that sets a new standard for system throughput, uptime and cost per wafer.
"Our DPS (decoupled plasma source) technology has been the
industry benchmark for metal and silicon etch for several years,"
noted David Bergeron, president of Applied Materials' Etch Products
Business Group. "We've spent the past year developing several key
productivity advancements that maximize our customers' throughput,
yield and cost of operation, particularly for 0.18 micron and below
device geometries. DPS Plus has the technology and productivity
performance to further extend its market leadership over several more
device generations."
The DPS Plus lets chipmakers produce significantly more wafers
per month in high volume production environments, due to features such
as a very fast VHP-plus dual arm transfer robot, improved process
capability, software enhancements, new fast cooldown chamber and
innovative chamber materials. Productivity is increased with system
throughput of more than 50 wafers per hour, extended Mean Wafers
Between Cleans (MWBC), and industry leading uptimes of greater than 90
percent. Overall, the system can process approximately 20 percent more
wafers per month in high-volume production environments over currently
available metal etch systems.
The new productivity features of the DPS Plus are also combined
with advances in process technology to bring metal etching to the next
level. Defect densities, a measure that becomes increasingly important
as feature sizes drop below 0.25 micron, have been reduced on the DPS
Plus to less than half those typically found on competitive systems,
for improved device yield in the fab. Reducing defect levels is
especially critical to chipmakers as chip sizes continue to grow.
Mike Morita, vice president of Applied Materials' Etch Products
Business Group, said, "The more than 200 Metal Etch DPS Centura
systems installed in fabs around the world have gained an
industry-wide reputation for long life, cost-effective operation and
extendible technology. The DPS Plus system takes those outstanding
qualities and elevates the production capability of the system even
further, so our customers can maximize their capital investments. This
new system gives our customers considerable additional value where it
counts the most, in day-to-day production."
The enhancements featured on the new DPS Plus can be field
retrofitted to the large installed base of DPS systems, allowing
customers to cost-effectively upgrade their tools to provide higher
levels of productivity.
According to Dataquest, the market for metal etch systems was
$690 million in 1998, and is projected to more than double to $1478
million by 2003. Applied Materials is the global market leader in
plasma etching, including the metal etch segment.
Applied Materials, Inc. is a Fortune 500 global growth company
and the world's largest supplier of wafer fabrication systems and
services to the global semiconductor industry. Applied Materials is
traded on the Nasdaq National Market System under the symbol "AMAT."
Applied Materials' web site is http://www.AppliedMaterials.com.
--30--azs/sf* CONTACT: Applied Materials, Inc., Santa Clara Betty Newboe (editorial/media), 408/563-0647 Carolyn Schwartz (financial community), 408/748-5227 KEYWORD: CALIFORNIA INDUSTRY KEYWORD: COMED COMPUTERS/ELECTRONICS PRODUCT