Applied Materials and A*STAR’s Institute of Microelectronics to Advance R&D in Fan-Out Wafer-Level Packaging
- The organizations announce a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in
- Fan-Out Wafer-Level Packaging is a key technology inflection in the semiconductor industry expected to help make chips and end-user devices smaller, faster and more power efficient
- Joint R&D Centre set to meet growing demand for use of fan-out multi-die packaging in mobile devices
With an anticipated additional
“Our collaboration with A*STAR over the past five years has been instrumental in establishing Applied Materials’ presence in
Dr. Raj. Thampuran, Managing Director, A*STAR, said, “Our relationship with
The Singapore Centre conducts WLP research across
“Applied Materials’ leading expertise in materials engineering drives the development of highly differentiated products and solutions that make new technologies possible,” said
A*STAR takes a long-term vision towards strategic investments in industry-ready R&D that contribute to Singapore’s economic growth. It is home to one of the premier advanced packaging and wafer-level packaging research facilities in
About the A*
For more information about IME, please visit www.ime.a-star.edu.sg.
We play a key role in nurturing and developing a diversity of talent and leaders in our Agency and
For more information on A*STAR, please visit www.a-star.edu.sg.
Applied Materials: Kevin Winston( USA) +1 (408) 235-4498 email@example.com Seraphina Seng( Singapore) +65 63117531 firstname.lastname@example.org Institute of Microelectronics: Lynn Hong Agency for Science, Technology and Research +65 6419 6597 email@example.com Investor Relations Contact Applied Materials: Michael Sullivan+1 (408) 986-7977 firstname.lastname@example.org